Semiconductor Vacuum Chamber Component - Case Study
Case study: titanium UHV chamber component for semiconductor equipment.
Case Facts
| Application | UHV Chamber Component |
|---|---|
| Material | Grade 5 Ti-6Al-4V |
| Processes | 5-axis-machining, surface-finishing |
| Standards | ISO 9001 |
| Tolerance | ±0.005 mm |
Challenge
UHV component for etch chamber required: non-magnetic, minimal outgassing, Ra 0.2 µm finish.
Solution
Machined from Grade 5 forged billet on 5-axis. Electropolished to Ra 0.1 µm. Cleaned in Class 100 cleanroom.
Result
Outgassing < 10⁻⁹ Torr·L/s·cm². Non-magnetic verified. Zero particle contamination.